NISSOCURE TIC-188
A heat-triggered latent epoxy resin curing catalyst
A heat-triggered latent epoxy resin curing catalyst
NISSOCURE
What’s the inclusion？
Guest molecules are quenched between host molecules.
Inclusion Catalyst
NISSOCURE as inclusion catalyst is using imidazole as guest molecules.
NISSOCURE shows excellent property for curing epoxy resins.
advantages
- Stable Catalysts at R.T.
- Longer pot-life
Application
- Epoxy molding compounds for semiconductor Packages
- Co-agent
NISSOCURE TIC-188
TIC-188
【Material formulation】
Epoxy resin：100 TIC-188（as 2P4MHZ)：4
| Epoxy resin | 100 |
|---|---|
| Hardener | 50 |
| Silica | 900 |
| Wax | 2 |
| Silane coupling agent | 5 |
| catalyst | 2 |
【Storage Condition】 25℃
【Test condition】
175℃×70kgf/cm2 ×3min
Inquiries
Please use this form to contact us.